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    MIT engineers design surfaces that make water boil more efficiently

    The boiling of water or other fluids is an energy-intensive step at the heart of a wide range of industrial processes, including most electricity generating plants, many chemical production systems, and even cooling systems for electronics.

    Improving the efficiency of systems that heat and evaporate water could significantly reduce their energy use. Now, researchers at MIT have found a way to do just that, with a specially tailored surface treatment for the materials used in these systems.

    The improved efficiency comes from a combination of three different kinds of surface modifications, at different size scales. The new findings are described in the journal Advanced Materials in a paper by recent MIT graduate Youngsup Song PhD ’21, Ford Professor of Engineering Evelyn Wang, and four others at MIT. The researchers note that this initial finding is still at a laboratory scale, and more work is needed to develop a practical, industrial-scale process.

    There are two key parameters that describe the boiling process: the heat transfer coefficient (HTC) and the critical heat flux (CHF). In materials design, there’s generally a tradeoff between the two, so anything that improves one of these parameters tends to make the other worse. But both are important for the efficiency of the system, and now, after years of work, the team has achieved a way of significantly improving both properties at the same time, through their combination of different textures added to a material’s surface.

    “Both parameters are important,” Song says, “but enhancing both parameters together is kind of tricky because they have intrinsic trade off.” The reason for that, he explains, is “because if we have lots of bubbles on the boiling surface, that means boiling is very efficient, but if we have too many bubbles on the surface, they can coalesce together, which can form a vapor film over the boiling surface.” That film introduces resistance to the heat transfer from the hot surface to the water. “If we have vapor in between the surface and water, that prevents the heat transfer efficiency and lowers the CHF value,” he says.

    Song, who is now a postdoc at Lawrence Berkeley National Laboratory, carried out much of the research as part of his doctoral thesis work at MIT. While the various components of the new surface treatment he developed had been previously studied, the researchers say this work is the first to show that these methods could be combined to overcome the tradeoff between the two competing parameters.

    Adding a series of microscale cavities, or dents, to a surface is a way of controlling the way bubbles form on that surface, keeping them effectively pinned to the locations of the dents and preventing them from spreading out into a heat-resisting film. In this work, the researchers created an array of 10-micrometer-wide dents separated by about 2 millimeters to prevent film formation. But that separation also reduces the concentration of bubbles at the surface, which can reduce the boiling efficiency. To compensate for that, the team introduced a much smaller-scale surface treatment, creating tiny bumps and ridges at the nanometer scale, which increases the surface area and promotes the rate of evaporation under the bubbles.

    In these experiments, the cavities were made in the centers of a series of pillars on the material’s surface. These pillars, combined with nanostructures, promote wicking of liquid from the base to their tops, and this enhances the boiling process by providing more surface area exposed to the water. In combination, the three “tiers” of the surface texture — the cavity separation, the posts, and the nanoscale texturing — provide a greatly enhanced efficiency for the boiling process, Song says.

    “Those micro cavities define the position where bubbles come up,” he says. “But by separating those cavities by 2 millimeters, we separate the bubbles and minimize the coalescence of bubbles.” At the same time, the nanostructures promote evaporation under the bubbles, and the capillary action induced by the pillars supplies liquid to the bubble base. That maintains a layer of liquid water between the boiling surface and the bubbles of vapor, which enhances the maximum heat flux.

    Although their work has confirmed that the combination of these kinds of surface treatments can work and achieve the desired effects, this work was done under small-scale laboratory conditions that could not easily be scaled up to practical devices, Wang says. “These kinds of structures we’re making are not meant to be scaled in its current form,” she says, but rather were used to prove that such a system can work. One next step will be to find alternative ways of creating these kinds of surface textures so these methods could more easily be scaled up to practical dimensions.

    “Showing that we can control the surface in this way to get enhancement is a first step,” she says. “Then the next step is to think about more scalable approaches.” For example, though the pillars on the surface in these experiments were created using clean-room methods commonly used to produce semiconductor chips, there are other, less demanding ways of creating such structures, such as electrodeposition. There are also a number of different ways to produce the surface nanostructure textures, some of which may be more easily scalable.

    There may be some significant small-scale applications that could use this process in its present form, such as the thermal management of electronic devices, an area that is becoming more important as semiconductor devices get smaller and managing their heat output becomes ever more important. “There’s definitely a space there where this is really important,” Wang says.

    Even those kinds of applications will take some time to develop because typically thermal management systems for electronics use liquids other than water, known as dielectric liquids. These liquids have different surface tension and other properties than water, so the dimensions of the surface features would have to be adjusted accordingly. Work on these differences is one of the next steps for the ongoing research, Wang says.

    This same multiscale structuring technique could also be applied to different liquids, Song says, by adjusting the dimensions to account for the different properties of the liquids. “Those kinds of details can be changed, and that can be our next step,” he says.

    The team also included Carlos Diaz-Martin, Lenan Zhang, Hyeongyun Cha, and Yajing Zhao, all at MIT. The work was supported by the Advanced Research Projects Agency-Energy (ARPA-E), the Air Force Office of Scientific Research, and the Singapore-MIT Alliance for Research and Technology, and made use of the MIT.nano facilities. More

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    New program bolsters innovation in next-generation artificial intelligence hardware

    The MIT AI Hardware Program is a new academia and industry collaboration aimed at defining and developing translational technologies in hardware and software for the AI and quantum age. A collaboration between the MIT School of Engineering and MIT Schwarzman College of Computing, involving the Microsystems Technologies Laboratories and programs and units in the college, the cross-disciplinary effort aims to innovate technologies that will deliver enhanced energy efficiency systems for cloud and edge computing.

    “A sharp focus on AI hardware manufacturing, research, and design is critical to meet the demands of the world’s evolving devices, architectures, and systems,” says Anantha Chandrakasan, dean of the MIT School of Engineering and Vannevar Bush Professor of Electrical Engineering and Computer Science. “Knowledge-sharing between industry and academia is imperative to the future of high-performance computing.”

    Based on use-inspired research involving materials, devices, circuits, algorithms, and software, the MIT AI Hardware Program convenes researchers from MIT and industry to facilitate the transition of fundamental knowledge to real-world technological solutions. The program spans materials and devices, as well as architecture and algorithms enabling energy-efficient and sustainable high-performance computing.

    “As AI systems become more sophisticated, new solutions are sorely needed to enable more advanced applications and deliver greater performance,” says Daniel Huttenlocher, dean of the MIT Schwarzman College of Computing and Henry Ellis Warren Professor of Electrical Engineering and Computer Science. “Our aim is to devise real-world technological solutions and lead the development of technologies for AI in hardware and software.”

    The inaugural members of the program are companies from a wide range of industries including chip-making, semiconductor manufacturing equipment, AI and computing services, and information systems R&D organizations. The companies represent a diverse ecosystem, both nationally and internationally, and will work with MIT faculty and students to help shape a vibrant future for our planet through cutting-edge AI hardware research.

    The five inaugural members of the MIT AI Hardware Program are:  

    Amazon, a global technology company whose hardware inventions include the Kindle, Amazon Echo, Fire TV, and Astro; 
    Analog Devices, a global leader in the design and manufacturing of analog, mixed signal, and DSP integrated circuits; 
    ASML, an innovation leader in the semiconductor industry, providing chipmakers with hardware, software, and services to mass produce patterns on silicon through lithography; 
    NTT Research, a subsidiary of NTT that conducts fundamental research to upgrade reality in game-changing ways that improve lives and brighten our global future; and 
    TSMC, the world’s leading dedicated semiconductor foundry.

    The MIT AI Hardware Program will create a roadmap of transformative AI hardware technologies. Leveraging MIT.nano, the most advanced university nanofabrication facility anywhere, the program will foster a unique environment for AI hardware research.  

    “We are all in awe at the seemingly superhuman capabilities of today’s AI systems. But this comes at a rapidly increasing and unsustainable energy cost,” says Jesús del Alamo, the Donner Professor in MIT’s Department of Electrical Engineering and Computer Science. “Continued progress in AI will require new and vastly more energy-efficient systems. This, in turn, will demand innovations across the entire abstraction stack, from materials and devices to systems and software. The program is in a unique position to contribute to this quest.”

    The program will prioritize the following topics:

    analog neural networks;
    new roadmap CMOS designs;
    heterogeneous integration for AI systems;
    onolithic-3D AI systems;
    analog nonvolatile memory devices;
    software-hardware co-design;
    intelligence at the edge;
    intelligent sensors;
    energy-efficient AI;
    intelligent internet of things (IIoT);
    neuromorphic computing;
    AI edge security;
    quantum AI;
    wireless technologies;
    hybrid-cloud computing; and
    high-performance computation.

    “We live in an era where paradigm-shifting discoveries in hardware, systems communications, and computing have become mandatory to find sustainable solutions — solutions that we are proud to give to the world and generations to come,” says Aude Oliva, senior research scientist in the MIT Computer Science and Artificial Intelligence Laboratory (CSAIL) and director of strategic industry engagement in the MIT Schwarzman College of Computing.

    The new program is co-led by Jesús del Alamo and Aude Oliva, and Anantha Chandrakasan serves as chair. More

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    Chemistry Undergraduate Teaching Lab hibernates fume hoods, drastically reducing energy costs

    The Department of Chemistry’s state-of-the-art Undergraduate Teaching Lab (UGTL), which opened on the fifth floor of MIT.nano in fall 2018, is home to 69 fume hoods. The hoods, ranging from four to seven feet wide, protect students and staff from potential exposure to hazardous materials while working in the lab. Fume hoods represent a tremendous energy consumption on the MIT campus; in addition to the energy required to operate them, the air that replaces what is exhausted must be heated or cooled. Thus, any lab with a large number of fume hoods is destined to be faced with high operational energy cost.

    “When the UGTL’s fume hoods are in use, the air-change rates — the number of times fresh air is exchanged in the space in a given time frame — averages between 25 and 30 air changes per hour (ACH),” says Nicole Imbergamo, senior sustainability project manager in MIT Campus Construction. “When the lab is unoccupied, that air-change rate averages 11 ACH. For context, in a laboratory with a single fume hood, typically MIT’s EHS [Environment, Health, and Safety] department would require six ACH when occupied and four ACH when unoccupied. Hibernation of the fume hoods allowed us to close the gap between the current unoccupied air-change rate and what is typical on campus in a non-teaching lab environment.”

    Fifty-eight of the 69 fume hoods in the UGTL are consistently unused between the hours of 6:30 p.m. and 12 p.m., as well as all weekend long, totaling 135 hours per week. Based on these numbers, the team determined it was safe to “hibernate” the fume hoods during the off hours, saving the Institute on fan energy and the cost of heating and cooling the air that gets flushed into each hood.

    John Dolhun PhD ’73 is the director of the UGTL. “The project started when MIT Green Labs — a division of the Environment, Health, and Safety Office now known as the Safe & Sustainable Labs Program — contacted the UGTL in October 2018, followed by an initial meeting in November 2018 with all the key players, including Safe and Sustainable Labs, the EHS Office, the Department of Facilities, and the Department of Chemistry,” says Dolhun. “It was during these initial discussions that the UGTL recognized this was something we had to do. The project was completed in April 2021.”

    Now, through a scheduled time clock in the Building Management System (BMS), the 58 fume hoods are flipped into hibernation mode at the end of each day. “In hibernation mode, the exhaust air valves go to their minimum airflow, which is lower than a fume hood minimum required when in use,” says Imbergamo. “As a safety feature, if the sash of a fume hood is opened while it is in standby mode, the valve and hood are automatically released from hibernation until the next scheduled time.” The BMS allows Dolhun and all with access to instantly view the hibernation status of every hood online, at any time, from any location. As an additional safety measure, the lab is equipped with an emergency kill switch that, when activated, instantly takes all 58 fume hoods out of hibernation, increasing the air changes per hour by about 37 percent, at one touch.

    The MIT operations team worked with the building controls vendor to create graphics that allow the UGTL users to easily see the hood sash positions and their current status as either hibernated or in normal operating mode. This virtual visibility allows the UGTL team to confirm the hoods are all closed before leaving the lab at the end of each day, and to confirm the energy reductions. This visual access also lends itself to educating the students on the importance of closing the sash at the end of their lab work, and gives an opportunity for educating the students on relevant fume hood management best practices that will serve them far beyond their undergraduate chemistry classes.

    Since employing the use of hibernation mode, the unoccupied UGTL air change rate has plummeted from 11 ACH to seven ACH, drastically shrinking unnecessary energy outflow, saving MIT an estimated $21,000 per year. The annual utility cost savings of both reduced supply and exhaust fan energy, as well as the heating and cooling required of the supply air to the space, will result in a less-than three-year payback for MIT. The overall success of the hood hibernation program, and the savings that it has afforded the UGTL, is very motivational for the Green Initiative. The highlights of this system will be shared with other labs, both at MIT and beyond, that may also benefit from similar adjustments. More