Workshop explores new advanced materials for a growing world
It is clear that humankind needs increasingly more resources, from computing power to steel and concrete, to meet the growing demands associated with data centers, infrastructure, and other mainstays of society. New, cost-effective approaches for producing the advanced materials key to that growth were the focus of a two-day workshop at MIT on March 11 and 12.A theme throughout the event was the importance of collaboration between and within universities and industries. The goal is to “develop concepts that everybody can use together, instead of everybody doing something different and then trying to sort it out later at great cost,” said Lionel Kimerling, the Thomas Lord Professor of Materials Science and Engineering at MIT.The workshop was produced by MIT’s Materials Research Laboratory (MRL), which has an industry collegium, and MIT’s Industrial Liaison Program. The program included an address by Javier Sanfelix, lead of the Advanced Materials Team for the European Union. Sanfelix gave an overview of the EU’s strategy to developing advanced materials, which he said are “key enablers of the green and digital transition for European industry.”That strategy has already led to several initiatives. These include a material commons, or shared digital infrastructure for the design and development of advanced materials, and an advanced materials academy for educating new innovators and designers. Sanfelix also described an Advanced Materials Act for 2026 that aims to put in place a legislative framework that supports the entire innovation cycle.Sanfelix was visiting MIT to learn more about how the Institute is approaching the future of advanced materials. “We see MIT as a leader worldwide in technology, especially on materials, and there is a lot to learn about [your] industry collaborations and technology transfer with industry,” he said.Innovations in steel and concreteThe workshop began with talks about innovations involving two of the most common human-made materials in the world: steel and cement. We’ll need more of both but must reckon with the huge amounts of energy required to produce them and their impact on the environment due to greenhouse-gas emissions during that production.One way to address our need for more steel is to reuse what we have, said C. Cem Tasan, the POSCO Associate Professor of Metallurgy in the Department of Materials Science and Engineering (DMSE) and director of the Materials Research Laboratory.But most of the existing approaches to recycling scrap steel involve melting the metal. “And whenever you are dealing with molten metal, everything goes up, from energy use to carbon-dioxide emissions. Life is more difficult,” Tasan said.The question he and his team asked is whether they could reuse scrap steel without melting it. Could they consolidate solid scraps, then roll them together using existing equipment to create new sheet metal? From the materials-science perspective, Tasan said, that shouldn’t work, for several reasons.But it does. “We’ve demonstrated the potential in two papers and two patent applications already,” he said. Tasan noted that the approach focuses on high-quality manufacturing scrap. “This is not junkyard scrap,” he said.Tasan went on to explain how and why the new process works from a materials-science perspective, then gave examples of how the recycled steel could be used. “My favorite example is the stainless-steel countertops in restaurants. Do you really need the mechanical performance of stainless steel there?” You could use the recycled steel instead.Hessam Azarijafari addressed another common, indispensable material: concrete. This year marks the 16th anniversary of the MIT Concrete Sustainability Hub (CSHub), which began when a set of industry leaders and politicians reached out to MIT to learn more about the benefits and environmental impacts of concrete.The hub’s work now centers around three main themes: working toward a carbon-neutral concrete industry; the development of a sustainable infrastructure, with a focus on pavement; and how to make our cities more resilient to natural hazards through investment in stronger, cooler construction.Azarijafari, the deputy director of the CSHub, went on to give several examples of research results that have come out of the CSHub. These include many models to identify different pathways to decarbonize the cement and concrete sector. Other work involves pavements, which the general public thinks of as inert, Azarijafari said. “But we have [created] a state-of-the-art model that can assess interactions between pavement and vehicles.” It turns out that pavement surface characteristics and structural performance “can influence excess fuel consumption by inducing an additional rolling resistance.”Azarijafari emphasized the importance of working closely with policymakers and industry. That engagement is key “to sharing the lessons that we have learned so far.”Toward a resource-efficient microchip industryConsider the following: In 2020 the number of cell phones, GPS units, and other devices connected to the “cloud,” or large data centers, exceeded 50 billion. And data-center traffic in turn is scaling by 1,000 times every 10 years.But all of that computation takes energy. And “all of it has to happen at a constant cost of energy, because the gross domestic product isn’t changing at that rate,” said Kimerling. The solution is to either produce much more energy, or make information technology much more energy-efficient. Several speakers at the workshop focused on the materials and components behind the latter.Key to everything they discussed: adding photonics, or using light to carry information, to the well-established electronics behind today’s microchips. “The bottom line is that integrating photonics with electronics in the same package is the transistor for the 21st century. If we can’t figure out how to do that, then we’re not going to be able to scale forward,” said Kimerling, who is director of the MIT Microphotonics Center.MIT has long been a leader in the integration of photonics with electronics. For example, Kimerling described the Integrated Photonics System Roadmap – International (IPSR-I), a global network of more than 400 industrial and R&D partners working together to define and create photonic integrated circuit technology. IPSR-I is led by the MIT Microphotonics Center and PhotonDelta. Kimerling began the organization in 1997.Last year IPSR-I released its latest roadmap for photonics-electronics integration, “which outlines a clear way forward and specifies an innovative learning curve for scaling performance and applications for the next 15 years,” Kimerling said.Another major MIT program focused on the future of the microchip industry is FUTUR-IC, a new global alliance for sustainable microchip manufacturing. Begun last year, FUTUR-IC is funded by the National Science Foundation.“Our goal is to build a resource-efficient microchip industry value chain,” said Anuradha Murthy Agarwal, a principal research scientist at the MRL and leader of FUTUR-IC. That includes all of the elements that go into manufacturing future microchips, including workforce education and techniques to mitigate potential environmental effects.FUTUR-IC is also focused on electronic-photonic integration. “My mantra is to use electronics for computation, [and] shift to photonics for communication to bring this energy crisis in control,” Agarwal said.But integrating electronic chips with photonic chips is not easy. To that end, Agarwal described some of the challenges involved. For example, currently it is difficult to connect the optical fibers carrying communications to a microchip. That’s because the alignment between the two must be almost perfect or the light will disperse. And the dimensions involved are minuscule. An optical fiber has a diameter of only millionths of a meter. As a result, today each connection must be actively tested with a laser to ensure that the light will come through.That said, Agarwal went on to describe a new coupler between the fiber and chip that could solve the problem and allow robots to passively assemble the chips (no laser needed). The work, which was conducted by researchers including MIT graduate student Drew Wenninger, Agarwal, and Kimerling, has been patented, and is reported in two papers. A second recent breakthrough in this area involving a printed micro-reflector was described by Juejun “JJ” Hu, John F. Elliott Professor of Materials Science and Engineering.FUTUR-IC is also leading educational efforts for training a future workforce, as well as techniques for detecting — and potentially destroying — the perfluroalkyls (PFAS, or “forever chemicals”) released during microchip manufacturing. FUTUR-IC educational efforts, including virtual reality and game-based learning, were described by Sajan Saini, education director for FUTUR-IC. PFAS detection and remediation were discussed by Aristide Gumyusenge, an assistant professor in DMSE, and Jesus Castro Esteban, a postdoc in the Department of Chemistry.Other presenters at the workshop included Antoine Allanore, the Heather N. Lechtman Professor of Materials Science and Engineering; Katrin Daehn, a postdoc in the Allanore lab; Xuanhe Zhao, the Uncas (1923) and Helen Whitaker Professor in the Department of Mechanical Engineering; Richard Otte, CEO of Promex; and Carl Thompson, the Stavros V. Salapatas Professor in Materials Science and Engineering. More